The Uppsala group were also ready to undertake deposition of copper metallic by ALD utilizing copper(I) chloride.23 In this instance, the copper metal was deposited on tantalum metallic foils, utilizing an evaporation temperature of 350°C plus a deposition temperature choice of 360°C– 410°C. The growth per cycle (GPC) was minimal https://archertleyq.p2blogs.com/21545606/the-definitive-guide-to-ald-research